TECHNICAL PROGRAM COMMITTEES
Alhussein Abouzeid, Rensselaer Polytechnic Institute, USA
Fatemeh Afghah, Clemson University, USA
Anwer Al-Dulaimi, EXFO Inc., Canada
Antonios Argyriou, University of Thessaly, Greece
Christopher Anderson, NTIA, USA
Bayaner Arigong, Florida State University, USA
Vladimir Atanasovski, Ss Cyril and Methodius University in Skopje, Macedonia
Saewoong Bahk, Seoul National University, South Korea
Mark Beach, University of Bristol, United Kingdom
Ralf Bendlin, AT&T Labs, USA
Randall Berry, Northwestern University, USA
Dinesh Bharadia, University of California, San Diego, USA
Satheesh Bojja Venkatakrishnan, Florida International University, USA
Danijela Cabric, University of California Los Angeles, USA
Zhichao Cao, Michigan State University, USA
Abhishek Chakraborty, UC San Diego, USA
Rajarathnam Chandramouli, Spectronn Inc, USA
Tingjun Chen, Duke University, USA
Zicheng Chi, Cleveland State University, USA
Andrew Clegg, Google, USA
Simon Cotton, Queen's University, Belfast, United Kingdom
Keerthi Priya Dasala, Rice University, USA
Harpreet Dhillon, Virginia Tech, USA
Charles Dietlein, NTIA, USA
Mike DiFrancisco, Virginia Tech Applied Research Corporation, USA
Haichuan Ding, University of Michigan, USA
Zhi Ding, University of California at Davis, USA
Aveek Dutta, University at Albany, SUNY, USA
Tamer ElBatt, The American University in Cairo, Egypt
Kamran Entesari, Texas A&M University, USA
Abdullah Eroglu, North Carolina A&T State University, USA
Takeo Fujii, The University of Electro-Communications, Japan
Bo Gao, Beijing Jiaotong University, China
Dennis Goeckel, University of Massachusetts, USA
Liangyi Gong, Chinese Academy of Sciences, China
David Grace, University of York, United Kingdom
Yong Guan, Iowa State University, USA
Zhangyu Guan, University at Buffalo, USA
Michael Gundlach, Self-Employed, Germany
Syed Jafar, University of California Irvine, USA
Hamid Jafarkhani, University of California, Irvine, USA
Mingyue Ji, University of Utah, USA
Zhiyuan Jiang, Shanghai University, China
Hamid Reza Karimi, Huawei Technologies, United Kingdom
Haesik Kim, VTT Technical Research Centre, Finland
Hyoil Kim, Ulsan National Institute of Science and Technology (UNIST), South Korea
Seong-Lyun Kim, Yonsei University, South Korea
Paul Kolodzy, Kolodzy Consulting, USA
Bhaskar Krishnamachari, University of Southern California, USA
Marwan Krunz, University of Arizona, USA
Vireshwar Kumar, Indian Institute of Technology Delhi, India
Won Cheol Lee, Soongsil University, South Korea
William Lehr, Massaschusetts Institute of Technology, USA
Changzhi Li, Texas Tech University, USA
Husheng Li, Purdue University, USA
Daibo Liu, Hunan University, China
Jia Liu, The Ohio State University, USA
Youjian Liu, University of Colorado at Boulder, USA
David Love, Purdue University, USA
Zhuo Lu, University of South Florida, USA
Sirani M. Perera, Embry-Riddle Aeronautical University, USA
Allen MacKenzie, Tennessee Tech, USA
Arjuna Madanayake, Florida International University, USA
Narayan Mandayam, Rutgers University, USA
Peter Mathys, University of Colorado, USA
Marja Matinmikko-Blue, University of Oulu, Finland
Arturas Medeisis, Vilnius Gediminas Technical University, Lithuania
Nobuhiko Miki, Kagawa University, Japan
Gary Minden, University of Kansas, USA
Nadia Yoza Mitsuishi, NIST, USA
Klaus Moessner, University of Surrey, United Kingdom
Markus Dominik Mueck, Intel Deutschland GmbH, Germany
Jad Nasreddine, i2CAT Foundation, Spain
Arun Natarajan, Oregon State University, USA
James Neel, Cognitive Radio Technologies, LLC, USA
Timothy Newman, DeepSig, USA
Jonatan Ostrometzky, Tel Aviv University, Israel
Aditya Padaki, Amazon Lab126, USA
Dimitris Pados, Florida Atlantic University, USA
Samuel Palermo, Texas A&M University, USA
Bernd-Peter Paris, George Mason University, USA
Neal Patwari, Washington University in St. Louis, USA
Filip Perich, Google, Inc, USA
Marina Petrova, RWTH Aachen University, Germany
Ali Pezeshki, Colorado State University, USA
Sofie Pollin, KU Leuven, Belgium
Lijun Qian, Prairie View A&M University, USA
Mubashir Husain Rehmani, Cork Institute of Technology, Ireland
Yanzhi Ren, University of Electronic Science and Technology, China
Francesco Restuccia, Northeastern University, USA
Dennis Roberson, Roberson and Associates, LLC, USA
Yalin Sagduyu, Virginia Tech, USA
Dola Saha, University at Albany, SUNY, USA
Anant Sahai, UC Berkeley, USA
Koya Sato, The University of Electro-Communications, Japan
Ivan Seskar, Rutgers University, USA
Raj Sivalingham, UK Government, USA
Houbing Song, University of Maryland, Baltimore County, USA
Alex Sprintson, Texas A&M University, USA
Thomas Stahlbuhk, MIT Lincoln Laboratory, USA
David Starobinski, Boston University, USA
John Stine, The MITRE Corporation, USA
Weiping Sun, Samsung Research, South Korea
Ravi Tandon, University of Arizona, USA
Leandros Tassiulas, Yale University, USA
Alireza Vahid, Rochester Institute of Technology, USA
Azadeh Vosoughi, University of Central Florida, USA
Mai Vu, Tufts University, USA
Mehmet Vuran, University of Nebraska-Lincoln, USA
Kenneth Wallstedt, Ericsson, Sweden
Xin Wang, Stony Brook University, USA
Ermin Wei, Northwestern University, USA
Martin Weiss, University of Pittsburgh, USA
Jason Whalley, Northumbria University, United Kingdom
Adam Wolisz, TUB, Germany
Chenshu Wu, The University of Hong Kong, Hong Kong
Chung-Tse Michael Wu, Rutgers University, USA
Hao Xu, University of Nevada, Reno, USA
Jie Xu, University of Miami, USA
Panlong Yang, University of Science and Technology, China
Seppo Yrjölä, Nokia, Finland
Cunxi Yu, University of Utah, USA
Yonghong Zeng, Institute for Infocomm Research, Singapore
Zhi-Li Zhang, University of Minnesota, USA
Mariya Zheleva, University at Albany, SUNY, USA
Xiaolong Zheng, Beijing University of Posts and Telecommunications, China
Hongzi Zhu, Shanghai Jiao Tong University, China
